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PROfiler UltraSlim
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PROfiler.
PROwave.
PROsentry.
Heat Barriers.
PROfiler.
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Heat Barriers.

A new dimension in temperature profiling

 

With the emergence of lead free

processes, thermal profiling

has never been so critical.

The UltraSlim range of Thermal

Profiling Systems will give you confidence

and control over your reflow and wave

soldering process. Existing or new lead

free thermal profiles can be rapidly

captured and analysed, allowing

you to reduce production costs

and machine downtime.

 

• Ease the move to lead free solder

• Make machine adjustments from an

  informed standpoint

• Reduce scrap and rework costs

• Ease process control documentation

  & overhead

• Use your profiles to maximise

  production throughput

• Improve process quality and

  consistency

• Measure and monitor process

  improvement

• Minimise troubleshooting time on

  problem processes

 

100% confidence in every PCB produced

 

• The small and light thermal profiler will fit through virtually

   any machine or process

• Up to 16 measurement channels for temperature profiling

   of the largest PCB’s

• High efficiency, fast cool heat barriers provide protection

  against lead free processes

• Rapid release barrier system eases thermal profiling data

  logger disconnection and download

• Simple yet powerful windows software provides all tools

  to analyze your data.

 

Use the PROpredict feature within the software

to analyse and modify your process settings

without the need for repeated profile runs.

 

Save multiple types of information into

a template for future production runs

such as oven configuration, tolerance

indicators, and thermocouple placement.

Print comprehensive SPC reports for

your reflow and wave processes.

 

System accuracy                   ±1ºC (±1.8ºF)

Internal resolution                  0.02ºC (0.036ºF)

Number of channels               up to 16 Type-K

Sample period                        100mS to 10secs

Storage                                 32000 data points

Measurement range               -150ºC to 600ºC (-237ºF to 1112ºF)

Batteries                                2 x Lithium coin cells

Battery Life                            600 runs (low battery warning)

Data logger size                      170 x 50 x 8.5mm (6.9 x 2 x 0.3")

Thermal Barrier size               (9ch) 265 x 80 x 20mm (10.4 x 3.2 x 0.8")

 

 

Standard equipment   

      • 16 channel UltraSlim data logger

     • 9 channel heat barrier

     • PC analysis software and download lead

     • 9 Type-K thermocouples and leads

     • Equipment case & spare batteries

 

Options

     • 12 & 16 channel heat barrier

 

Analysis software

       • Configure the data logger for accurate process

         parameter capture

      • Place and name probe icons for total traceability

      • Print comprehensive reports of your reflow or

         wave soldering process.

      • Predict the effect of conveyor speed and zone

         temperature changes